soldering machine is a common automation equipment in modern society. With the continuous development of modern electronic technology, information technology and NC robot technology, laser soldering machine has gradually become one of the important parts of the welding industry, and the technology is becoming more and more mature. The use of soldering machine improves the work efficiency of enterprises by 20% - 80%. With the higher and higher requirements of soldering process, manual soldering will gradually be eliminated. At present, automatic welding technology has become the mainstream trend in industry.
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Application field of soldering machine:
?1. Electromechanical parts
such as printed motherboard, small switch, capacitor, variable resistor, crystal oscillator, LCD, magnetic head, relay, connector, engine, transformer, etc; Many PCB boards cannot be welded by wave soldering because of problems such as output and product process flow, and manual soldering affects the improvement of output. Automatic soldering can be realized by soldering machine.
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2. Precision electronic products
such as cameras, cameras, VTRs, electronic clocks, personal computers, PDAs, printers, copiers, calculators, LCD TVs, medical devices, etc., automatic soldering machines can be used to improve the output and quality of products
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3, household appliances
such as DVD, audio equipment , car navigation system, video game console, TV, radio, washing machine, vacuum cleaner, etc. when wave soldering cannot be used, soldering machine can be used for operation.
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4, high-end field
in aerospace, aviation, national defense, automobile and high-end communication industries, in order to pursue the reliability of solder joints under extreme conditions, through-hole components are still the best choice (the welding of surface mounted components is completed on one surface, while in the welding of through-hole components, the solder wraps the pins of the whole component, so the reliability is better from the mechanical point of view).
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5, electronic components
components that are sensitive to temperature and cannot be reflow and wave soldering, dip encapsulated components, connectors, sensors, transformers, shields, cables, horns, motors, etc. Mixed circuit boards, soft and hard bonding boards, rigid and flexible bonding boards, and target boards with three-dimensional structure or stacking design limit the use of production equipment such as reflow soldering and wave soldering.